FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxOperate
FHW1210HC6R8KGT 6.8µH 10% 20@7.9MHz 20 8
FHW1008UC6R8KGT 6.8µH 10% 18@7.9MHz 18 8.2
FHW1008UC6R8JGT 6.8µH 5% 18@7.9MHz 18 8.2
FHW1210HC5R6KGT 5.6µH 10% 20@7.9MHz 20 5
FHW1210HC5R6JGT 5.6µH 5% 20@7.9MHz 20 5
FHW1008UC5R6JGT 5.6µH 5% 18@7.9MHz 18 7.6
FHW1008UC5R6KGT 5.6µH 10% 18@7.9MHz 18 7.6
FHW1210HC4R7KGT 4.7µH 10% 16@25MHz 16 4
FHW1210HC4R7JGT 4.7µH 5% 16@25MHz 16 4
FHW1008UC4R7JGT 4.7µH 5% 18@25MHz 18 4
FHW1008UC4R7KGT 4.7µH 10% 18@25MHz 18 4
FHW1008UC4R3JGT 4.3µH 5% 18 3.8
FHW1008UC4R3GGT 4.3µH 2% 18 3.8
FHW1008UC4R3KGT 4.3µH 10% 18 3.8
FHW1210HC3R9JGT 3.9µH 5% 20@25MHz 20 3.6
A total of 49 page 735 data