FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxOperate
FHW1008UC3R0KGT 3.0µH 10% 22 3.3
FHW1008UC3R0GGT 3.0µH 2% 22 3.3
FHW1210HC2R7JGT 2.7µH 5% 25@25MHz 25 2.85
FHW1210HC2R7KGT 2.7µH 10% 25@25MHz 25 2.85
FHW1210HC2R7GGT 2.7µH 2% 25@25MHz 25 2.85
FHW1008UC2R7JGT 2.7µH 5% 22@25MHz 22 3.2
FHW1008UC2R7KGT 2.7µH 10% 22@25MHz 22 3.2
FHW1008UC2R7GGT 2.7µH 2% 22@25MHz 22 3.2
FHW1210HC2R6KGT 2.6µH 10% 25 2.5
FHW1210HC2R6GGT 2.6µH 2% 25 2.5
FHW1210HC2R6JGT 2.6µH 5% 25 2.5
FHW1210HC2R2KGT 2.2µH 10% 30@50MHz 30 2.41
FHW1210HC2R2GGT 2.2µH 2% 30@50MHz 30 2.41
FHW1210HC2R2JGT 2.2µH 5% 30@50MHz 30 2.41
FHW1008UC2R2KGT 2.2µH 10% 20@50MHz 20 2.8
A total of 49 page 735 data