FEATURES

Minature size, suitable for SMT;

Using terminal electrode structure to restrain the

parasitic component effect quite caused by lead;

Execellent in solderability and heat resistance.

High Q value and Tight inductance tolerance


APPLICATIONS

Portable communication equipment and PDA;

High speed electronic device;

RF Wireless Data Communication Module,W-LAN.


FHW Series Wire Wound Chip Ceramic Iinductors Product Service

Application

Component Library

Product Certificate

FHW Series Wire Wound Chip Ceramic Iinductors Product List
Part NumberInductanceToleranceQ ValueSelf-Resonant FrequencyDCR MaxOperate
FHW1008UC2R2KGT 2.2µH 10% 20@50MHz 20 2.8
FHW1008UC2R2GGT 2.2µH 2% 20@50MHz 20 2.8
FHW0805UC2R2KGT 2.2µH 10% 16@7.9MHz 16 4.2
FHW0805UC2R2JGT 2.2µH 5% 16@7.9MHz 16 4.2
FHW1008UC2R0KGT 2.0µH 10% 20 2.8
FHW1008UC2R0GGT 2.0µH 2% 20 2.8
FHW1008UC2R0JGT 2.0µH 5% 20 2.8
FHW1210HC1R8GGT 1.8µH 2% 30@50MHz 30 2.25
FHW1210HC1R8JGT 1.8µH 5% 30@50MHz 30 2.25
FHW1210HC1R8KGT 1.8µH 10% 30@50MHz 30 2.25
FHW1008UC1R8GGT 1.8µH 2% 28@50MHz 28 2.6
FHW1008UC1R8KGT 1.8µH 10% 28@50MHz 28 2.6
FHW1008UC1R8JGT 1.8µH 5% 28@50MHz 28 2.6
FHW0805UC1R8JGT 1.8µH 5% 18@50MHz 18 3.8
FHW0805UC1R8KGT 1.8µH 10% 18@50MHz 18 3.8
A total of 49 page 735 data